主要應用(Application):
晶片研磨、切割及軟性電子零件之承載加工。
塗佈特殊黏膠，具高黏著力,使晶片於研磨、切割過程不脫落、飛散。
加工結束後，照射紫外線，即變成不沾黏，容易取下而不殘膠。
產品特點(Feature):
特殊黏膠配方，黏着力佳，切割時工作物不飛散。
降低影響切割刀壽命。
照射UV反應時間快速，有效提升工作效率。
Primary application:
UV tape is applied in wafer grinding/cutting and the load processing of flexible electronic components.
Our UV tape is coated with a special strong adhesive to prevent wafers from dislodging during grinding or cutting.
Once the workpiece has been processed, a UV light can be introduced to break the adhesive bonds for clean and easy release.
Product features:
Our UV tape is manufactured using a unique adhesive formula. It manifests superior adhesion capabilities to prevent workpieces from dislodging during cutting processes.
Our UV tape reduces wear on cutting blades, prolonging service life.
Our UV tape reacts instantaneously to UV light, maximizing work efficiency
