YOTOKU provides a diversity of material for probe needle for customers to choose from according to their manufacturing preference.
Etched Needle is most frequently used by our customers because of its lower cost, shorter lead time, and our ability of controlling the best precision. Presently, we also introduce special Machined Needle to meet FINE PITCH manufacturing requirement which can be made according to customer’s design.
主要應用(Application):
晶片研磨、切割及軟性電子零件之承載加工。
塗佈特殊黏膠，具高黏著力,使晶片於研磨、切割過程不脫落、飛散。
加工結束後，照射紫外線，即變成不沾黏，容易取下而不殘膠。
Primary application:
UV tape is applied in wafer grinding/cutting and the load processing of flexible electronic components.
Our UV tape is coated with a special strong adhesive to prevent wafers from dislodging during grinding or cutting.
Once the workpiece has been processed, a UV light can be introduced to break the adhesive bonds for clean and easy release.
III-V族wafer經由背面研磨減薄後進行微影、金屬化、刻蝕..等工藝，使用基座加熱至所需溫度後將其鍵合蠟溶解，再經由上下真空吸盤建立真空吸力後，使用步進馬達驅動方式向前移動進而與晶圓分離。
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